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Pcb Products:RF/Microwave PCB (RF PCB),Electronic / Industrial PCB,Heavy Copper PCB,Rigid-Flex PCB ...

Taiwan Factory
Layer count 2 ~ 20 layers
Min. Core Thickness 2 mil 1/1 oz copper
Min. Board Thickness 2L=>10mil     4L=>16mil     6L=>18mil     8L=>25mil
Max Board Thickness 0.197"  ( 5 mm)
Max Working Panel Size 21" x 24"
Material FR4(standard) Isola / Nanya / ITEQ
FR4(Hi-Tg) Isola / Nanya / ITEQ
Rogers RO4003 /4350 /3010 /RT Duroid 5880 / 5870
Arlon Diclad 25N / 25FR / 870 / 880
Taconic TLY / TLC / RF35 / RF30
GETEK RG200D / ML200D
Aluminum PCBs Di-electric materials : FR4 / Bergquist / Rogers / Thermagon
Copper weight 1 ~ 5 oz  internal & external layers
Drilling Min. Drilled Hole Size 10 mil ( 6 ~ 8 mil finished)
Annular Ring 5 mil(normal)    /    4 mil (for Laser vias)
Registration ± 3 mil
Max. Aspect Ratio 10 :1
Hole Size Tolerance +/- 3 mils (PTH)  ;  +/- 2 mils (N-PTH)
Hole Roughness < 0.8 mil
Min. Cu Plating in Holes > 0.8mil,  Ave. 1 mil
 Laser drill  available
Image Transfer Min. Trace and space 4 / 4 mil
SMT / BGA.Pitch 10 mils for SMT   /    30 mils for BGA
Trace/space Tolerance ± 20%  (or +/- 10% per IPC class 3)
Solder Mask LPI Solder Mask Green(glossy or matte), Blue, Red, Black, Yellow
Via Plugging min. 80% filled
Solder Mask ink Taiyo & Tamura
Registration ± 2 mil
Min Solder Dam 2.5 mil
Thickness 0.5 ~1.5 mil
Silkscreen White, Yellow, Black
Min. silkscreen width 8 mil
CNC Dimension ± 5 mil
Punch Dimension ± 4 mil
Blind Vias / Buried Vias Yes
VIP (Via in Pad) Yes (Non-conductive epoxy resin-filled or Cu filled)
Impedance control   ± 10%
Surface Finish HASL 200 ~ 500 μ"
Pb free HASL 100 ~ 500 μ"
Immersion Gold 1 ~ 5 μ"
Immersion Silver 6 ~ 12 μ"
Immersion Tin 25 ~ 40 μ"
Electolytic Gold Yes
Gold Finger Plating 5 ~ 40 μ"
OSP(Entek) yes
Solder Mask Coating Method Silkscreen printing (Double or triple coatings available)
Carbon Ink 20 Ω
Peelable mask Thickness = 0.3 mm
Pumice Pre-treatment Available
China-Mass Production 
Item Paramerers
Single side Double side/Multi-layer Remarks
Max panel size   27" x 20" (686mmx508mm)  
Innerlayer line width/space(min.) 0.20/0.20mm 4 mil / 4 mil (100um/100um)  
Min innerlay pad   5 mil (0.13mm) Pad annular
Min core thickness   4 mil (0.1mm) No Cu Clad
Min dielectric thickness   3 mil (76um)  
Thickness of innerlayer copper 1~2oz 1/3oz、1/2oz、1oz、2oz (12um、17um、35um、70um)  
Thickness of outerlayer base copper   1/3oz、1/2oz、1oz、2oz (12um、17um、35um、70um)  
Thickness of finished panel 0.6~3.0mm 0.40~4.0mm  
Tolerance of finished
panel thickness
Thickness<1.0mm   ±12% 4-8 layers
1.0mm≦thickness<2.0mm   ± 8% 4-8 layers
  ±10% 10 layers
 thickness≧2.0mm   ±10%  
Surface treating process of innerlayer   Black/Brown Oxide  
Layer count 1 2~18  
Registration of innerlayer to innerlayer   ± 3 mil (±76um)  
Min drilling diameter   0.25mm  
min diameter of finished hole   0.20mm  
Accurancy of hole position   ± 2 mil (±50um)  
Tolerance of drilled slot   ± 3 mil (±75um)  
Tolerance of PTH diameter   ± 2 mil (±50um)  
Tolerance of NPTH diameter   ± 1 mil (±25um)  
Max A.R. of PTH   8 :1  
PTH hole copper thickness   0.8 ~ 2mil (10-50um)  
Image to image tolerance   ± 3 mil (±75um)  
Outerlayer line width/space(min.) 0.20/0.20mm 4 mil / 4 mil (100um/100um)  
Tolerance of etching   ± 1mil (±25um)  
Type of solder mask   Taiyo PSR2000、NSR-9000 and others  
Thickness of solder mask   line end 0.4-1.2mil (10-30um)  
  line corner ≧0.2mil (5um)  
  On substrate ≦finished Cu thickness +1.2mil (≦finished Cu thickness +30um)  
Hardness of solder mask   6H  
Solder mask registration tolerance   ± 2 mil (±50um)  
Min solder mask dam   3.0 mil (70um)  
Max solder mask plug hole diameter   0.8 mm  
Surface treatment    HASL、gold finger、Au Plating Panel、OSP、ENIG  
Max nickel thickness of gold finger   280u" (7um)  
Max gold thickness of gold finger   60u" (1.5um)  
Range of nickel thickness
for electroless nickel and
immersion gold
  120u"/240u" (3um/6um)  
Range of gold thickness
for electroless nickel
and immersion gold
  2u"/6u" (0.05um/0.15um)  
Min routing dimension
tolerance (edge to edge)
  ± 4 mil (±0.10mm)  
Min routing dimension
tolerance (hole to edge)
  ± 3 mil (±0.075mm)  
V-cut angle   30°、45°、60°、90°  
Range of bevel angle   20°~60°  
Min legend line width/space   5 mil / 5 mil (0.125mm/0.125mm)  
Peel strength of line   ≧6IB/in (≧107g/mm)  
Ironic contamination   <1.0ugNaCI/cm2  
Impedance control and tolerance   50Ω±10%  
Warp and twist

1.50%

≦0.5%  
Type of ccl material   CEM3、FR-4、Halogen-Free、Tg150˚C FR-4、High CTI material、anti-CAF material  
Other process   Carbon ink, Peelable mask, Silver through-hole
None
 
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Tel : 886-3-4282725    Fax : 886-3-4282761 E-Mail : sales_airpro@airpro.com.tw