| Item |
Paramerers |
| Single side |
Double side/Multi-layer |
Remarks |
| Max panel size |
|
27" x 20" (686mmx508mm) |
|
| Innerlayer line width/space(min.) |
0.20/0.20mm |
4 mil / 4 mil (100um/100um) |
|
| Min innerlay pad |
|
5 mil (0.13mm) |
Pad annular |
| Min core thickness |
|
4 mil (0.1mm) |
No Cu Clad |
| Min dielectric thickness |
|
3 mil (76um) |
|
| Thickness of innerlayer copper |
1~2oz |
1/3oz、1/2oz、1oz、2oz (12um、17um、35um、70um) |
|
| Thickness of outerlayer base copper |
|
1/3oz、1/2oz、1oz、2oz (12um、17um、35um、70um) |
|
| Thickness of finished panel |
0.6~3.0mm |
0.40~4.0mm |
|
Tolerance of finished
panel thickness |
Thickness<1.0mm |
|
±12% |
4-8 layers |
| 1.0mm≦thickness<2.0mm |
|
± 8% |
4-8 layers |
| |
±10% |
10 layers |
| thickness≧2.0mm |
|
±10% |
|
| Surface treating process of innerlayer |
|
Black/Brown Oxide |
|
| Layer count |
1 |
2~18 |
|
| Registration of innerlayer to innerlayer |
|
± 3 mil (±76um) |
|
| Min drilling diameter |
|
0.25mm |
|
| min diameter of finished hole |
|
0.20mm |
|
| Accurancy of hole position |
|
± 2 mil (±50um) |
|
| Tolerance of drilled slot |
|
± 3 mil (±75um) |
|
| Tolerance of PTH diameter |
|
± 2 mil (±50um) |
|
| Tolerance of NPTH diameter |
|
± 1 mil (±25um) |
|
| Max A.R. of PTH |
|
8 :1 |
|
| PTH hole copper thickness |
|
0.8 ~ 2mil (10-50um) |
|
| Image to image tolerance |
|
± 3 mil (±75um) |
|
| Outerlayer line width/space(min.) |
0.20/0.20mm |
4 mil / 4 mil (100um/100um) |
|
| Tolerance of etching |
|
± 1mil (±25um) |
|
| Type of solder mask |
|
Taiyo PSR2000、NSR-9000 and others |
|
| Thickness of solder mask |
|
line end |
0.4-1.2mil (10-30um) |
|
| |
line corner |
≧0.2mil (5um) |
|
| |
On substrate |
≦finished Cu thickness +1.2mil (≦finished Cu thickness +30um) |
|
| Hardness of solder mask |
|
6H |
|
| Solder mask registration tolerance |
|
± 2 mil (±50um) |
|
| Min solder mask dam |
|
3.0 mil (70um) |
|
| Max solder mask plug hole diameter |
|
0.8 mm |
|
| Surface treatment |
|
HASL、gold finger、Au Plating Panel、OSP、ENIG |
|
| Max nickel thickness of gold finger |
|
280u" (7um) |
|
| Max gold thickness of gold finger |
|
60u" (1.5um) |
|
Range of nickel thickness
for electroless nickel and
immersion gold |
|
120u"/240u" (3um/6um) |
|
Range of gold thickness
for electroless nickel
and immersion gold |
|
2u"/6u" (0.05um/0.15um) |
|
Min routing dimension
tolerance (edge to edge) |
|
± 4 mil (±0.10mm) |
|
Min routing dimension
tolerance (hole to edge) |
|
± 3 mil (±0.075mm) |
|
| V-cut angle |
|
30°、45°、60°、90° |
|
| Range of bevel angle |
|
20°~60° |
|
| Min legend line width/space |
|
5 mil / 5 mil (0.125mm/0.125mm) |
|
| Peel strength of line |
|
≧6IB/in (≧107g/mm) |
|
| Ironic contamination |
|
<1.0ugNaCI/cm2 |
|
| Impedance control and tolerance |
|
50Ω±10% |
|
| Warp and twist |
1.50%
|
≦0.5% |
|
| Type of ccl material |
|
CEM3、FR-4、Halogen-Free、Tg150˚C FR-4、High CTI material、anti-CAF material |
|
| Other process |
|
Carbon ink, Peelable mask, Silver through-hole |
